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FDD8796/FDU8796 N-Channel PowerTrench(R) MOSFET March 2006 FDD8796/FDU8796 N-Channel PowerTrench(R) MOSFET 25V, 35A, 5.7m General Description This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(on) and fast switching speed. Features Max rDS(on) = 5.7m at VGS = 10V, ID = 35A Max rDS(on) = 8.0m at VGS = 4.5V, ID = 35A Low gate charge: Qg(10) = 37nC(Typ), VGS = 10V Low gate resistance Application Vcore DC-DC for Desktop Computers and Servers VRM for Intermediate Bus Architecture Avalanche rated and 100% tested RoHS Compliant LE A REE I DF D M ENTATIO LE N MP G D GDS I-PAK (TO-251AA) S Short Lead I-PAK G S MOSFET Maximum Ratings TC= 25C unless otherwise noted Symbol VDS VGS ID EAS PD TJ, TSTG Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous (Package Limited) -Continuous (Die Limited) -Pulsed Single Pulse Avalanche Energy Power Dissipation Operating and Storage Temperature (Note 1) (Note 2) Ratings 25 20 35 98 305 91 88 -55 to 175 mJ W C A Units V V Thermal Characteristics RJC RJA RJA Thermal Resistance, Junction to Case TO_252, TO_251 Thermal Resistance, Junction to Ambient TO_252, TO_251 Thermal Resistance, Junction to Ambient TO-252,1in2 copper pad area 1.7 100 52 C/W C/W C/W Package Marking and Ordering Information Device Marking FDD8796 FDU8796 FDU8796 Device FDD8796 FDU8796 FDU8796_F071 Package TO-252AA TO-251AA TO-251AA 1 Reel Size 13'' N/A (Tube) N/A (Tube) Tape Width 12mm N/A N/A Quantity 2500 units 75 units 75 units www.fairchildsemi.com (c)2006 Fairchild Semiconductor Corporation FDD8796/FDU8796 Rev. B FDD8796/FDU8796 N-Channel PowerTrench(R) MOSFET Electrical Characteristics TJ = 25C unless otherwise noted Symbol Parameter Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current Test Conditions ID = 250A, VGS = 0V ID = 250A, referenced to 25C VDS = 20V VGS = 0V VGS = 20V VGS = VDS, ID = 250A ID = 250A, referenced to 25C VGS = 10V, ID = 35A rDS(on) Drain to Source On Resistance VGS = 4.5V, ID = 35A VDS = 10V, ID = 35A TJ = 175C 1.2 1.8 -6.7 4.5 6.0 6.9 5.7 8.0 9.5 m TJ = 150C Min 25 7 1 250 100 Typ Max Units V mV/C A nA Off Characteristics BVDSS BVDSS TJ IDSS IGSS VGS(th) VGS(th) TJ On Characteristics Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient 2.5 V mV/C Dynamic Characteristics Ciss Coss Crss RG td(on) tr td(off) tf Qg Qg Qgs Qgd Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = 13V, VGS = 0V, f = 1MHz f = 1MHz 1960 455 315 1.1 2610 605 475 pF pF pF Switching Characteristics Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Total Gate Charge Gate to Source Gate Charge Gate to Drain Charge VGS = 0 to10V VGS = 0 to 5V VDD =13V, ID = 35A, Ig = 1.0mA VDD =13V, ID = 35A VGS = 10V, RGS = 20 10 24 99 57 37 19 6 6 20 39 158 91 52 27 ns ns ns ns nC nC nC nC Drain-Source Diode Characteristics VSD trr Qrr Source to Drain Diode Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 35A VGS = 0V, IS = 15A IF = 35A, di/dt = 100A/s IF = 35A, di/dt = 100A/s 0.9 0.8 30 23 1.25 1.0 45 35 V V ns nC Notes: 1: Pulse time < 300s, Duty cycle = 2%. 2: Starting TJ = 25C, L = 0.3mH, IAS = 24.7A, VDD = 23V, VGS = 10V. FDD8796/FDU8796 Rev. B 2 www.fairchildsemi.com FDD8796/FDU8796 N-Channel PowerTrench(R) MOSFET Typical Characteristics TJ = 25C unless otherwise noted NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 70 60 ID, DRAIN CURRENT (A) VGS = 10V 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 10 VGS = 4.5V VGS = 3.5V VGS = 3V 50 40 30 20 10 0 0 PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX VGS = 4.5V VGS = 3.5V VGS = 3V VGS = 10V 1 2 3 VDS, DRAIN TO SOURCE VOLTAGE (V) 4 20 30 40 50 ID, DRAIN CURRENT(A) 60 70 Figure 1. On Region Characteristics Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage 14 NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 1.8 1.6 1.4 1.2 1.0 0.8 0.6 -80 VGS = 10V rDS(on), ON-RESISTANCE (m) ID = 35A ID =35A 12 10 8 6 4 2 PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX TJ = 175oC TJ = 25oC -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC) 200 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10 Figure 3. Normalized On Resistance vs Junction Temperature 70 Figure 4. On-Resistance vs Gate to Source Voltage 100 ID, DRAIN CURRENT (A) 60 50 40 30 20 10 0 0 PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX TJ = 175oC IS, REVERSE DRAIN CURRENT (A) VGS = 0V 10 TJ = 175oC 1 0.1 0.01 1E-3 0.0 TJ = -55oC TJ = 25oC TJ = -55oC TJ = 25oC 2 3 4 VGS, GATE TO SOURCE VOLTAGE (V) 1 0.3 0.6 0.9 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode Forward Voltage vs Source Current FDD8796/FDU8796 Rev. B 3 www.fairchildsemi.com FDD8796/FDU8796 N-Channel PowerTrench(R) MOSFET Typical Characteristics TJ = 25C unless otherwise noted VGS, GATE TO SOURCE VOLTAGE(V) 10 8 6 4 2 0 VDD = 10V VDD = 13V VDD = 16V 4000 Ciss CAPACITANCE (pF) 1000 Coss Crss f = 1MHz VGS = 0V 0 10 20 30 Qg, GATE CHARGE(nC) 40 100 0.1 1 10 30 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics 50 IAS, AVALANCHE CURRENT(A) Figure 8. Capacitance vs Drain to Source Voltage 100 ID, DRAIN CURRENT (A) TJ = 25oC 80 VGS = 10V 10 TJ = 125oC 60 40 20 0 25 VGS = 4.5V TJ = 150oC RJC = 1.7 C/W o 1 0.01 0.1 1 10 100 300 tAV, TIME IN AVALANCHE(ms) 50 75 100 125 150 TC, CASE TEMPERATURE(oC) 175 Figure 9. Unclamped Inductive Switching Capability 1000 Figure 10. Maximum Continuous Drain Current vs Case Temperature 10000 P(PK), PEAK TRANSIENT POWER (W) ID, DRAIN CURRENT (A) 10us VGS = 10V TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: 175 - TC ---------------------150 100 100us 10 LIMITED BY PACKAGE 1000 I = I25 1ms SINGLE PULSE TJ = MAX RATED TC = 25oC 1 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on) 10ms DC 100 50 -5 10 SINGLE PULSE 0.1 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 40 10 -4 10 10 10 t, PULSE WIDTH (s) -3 -2 -1 10 0 10 1 Figure 11. Forward Bias Safe Operating Area Figure 12. Single Pulse Maximum Power Dissipation FDD8796/FDU8796 Rev. B 4 www.fairchildsemi.com FDD8796/FDU8796 N-Channel PowerTrench(R) MOSFET Typical Characteristics TJ = 25C unless otherwise noted 2 1 NORMALIZED THERMAL IMPEDANCE, ZJC DUTY CYCLE-DESENDING ORDER 0.1 D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM 0.01 t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC SINGLE PULSE 1E-3 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t, RECTANGULAR PULSE DURATION(s) Figure 13. Transient Thermal Response Curve FDD8796/FDU8796 Rev. B 5 www.fairchildsemi.com TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FDD8796/FDU8796 N-Channel PowerTrench(R) MOSFET ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM FPSTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I18 Preliminary No Identification Needed Full Production Obsolete Not In Production FDD8796/FDU8796 Rev. B 6 www.fairchildsemi.com |
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